Do you know the principle of multi-wire cutting machine?

Silicon wafers are the main production material in the semiconductor and photovoltaic fields. Silicon wafer multi-wire cutting machine Technology is the current silicon wafer processing technology in the world. It is different from traditional cutting methods such as saw blades and grinding wheels, as well as other laser cutting and inner circle cutting. The principle is that the high-speed moving steel wire drives the cutting edge material attached to the steel wire to rub against the silicon rod, so as to achieve the cutting effect. During the whole process, the steel wire is guided by more than a dozen wire wheels, forming a wire mesh on the main wire roll, and the workpiece to be processed is fed down from the worktable. Compared to other technologies, silicon wafers Multi-wire cutting machine The technology has the advantages of high efficiency, high productivity and high precision. It is the most widely used silicon wafer cutting technology.

Multi-wire cutting machine technology is a signature innovation in the silicon processing industry and the solar photovoltaic industry, replacing the original inner circle cutting equipment . Compared with the inner circle slicing technology, the diced wafer has small BOW, small WARP, good parallelism, small total thickness tolerance (TTA) discreteness, small cutting edge cutting loss, shallow surface damage layer, and wafer surface roughness. Small and other advantages.

The solar silicon wafer wire cutting mechanism is that the machine guide wheel drives the steel wire when the machine runs at high speed, so that the mortar mixed with silicon carbide powder is sent to the cutting area by the steel wire.

During the working process of the multi-wire cutting machine, the viscosity of the cutting fluid, the particle shape and particle size of the silicon carbide powder, the viscosity of the mortar, the flow rate of the mortar, the speed of the steel wire, the tension of the steel wire and the feeding speed of the workpiece have an impact on the quality of the silicon wafer. and yield play a major role.

Consultation is welcome if necessary.